Understanding Sources of Residual Stress in PDC by X-Ray Diffraction

Industrial Diamond Association – Finer Points Magazine
An attempt had been made to identify the sources of residual stress in polycrystalline diamond cutters (PDC) by X-ray diffraction (XRD). Residual stress was measured in a finished 16mm PDC insert
Changes in residual stress were observed as the substrate was removed by grinding. Residual stress was also measured in the remaining diamond disc after leaching out the cobalt. Comparison between the as-pressed PDC, after removing the substrate, and after removing the cobalt show the relative contribution of geometry, cobalt, and high pressure-high temperature processing to overall residual stress. An additional measurement was made of diamond powder compacted at HTHP without sintering to evaluate the influence of diamond particle deformation on residual stress.

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